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Part No.
MFG
D/C
QTY
Packaging

DT121N12
EUPEC
04+
140
MODULE

FGC800B-130DS
MITSUBIS
06+
83
MODULE

TD170N16
EUPEC
10+
170
MODULE

TT425N18KOF
EUPEC
05+
100
MODULE

DT81F
INFINEON
10+
152
module

ATN3580-01
Skyworks
16+
2831

HMC541LP3ETR-AN
AD
16+
109

TLC2932IPWG4
TI
16+
543
TSSOP-14

HMC439QS16GETR
AD|Hittite
16+
1308

HMC339
AD|Hittite
16+
50

HMC408LP3E
AD|Hittite
16+
126

SMA66-1
MACOM
16+
5

MC13237CHTR
NXP|Freescale
16+
578

BGS12AL74E6327XTSA1
Infineon
16+
130

CC2560AYFVR
TI
16+
3055

TZ800N12KOF
Infineon
16+
42

723631L15PFG8
IDT
16+
78
TQFP-120

AD7814
AD
17+
2229
8 ld MSOP,8 ld SOIC,CHIPS OR DIE

AD588
AD
17+
210
8 ld SOIC,ROUND HEADER/METAL CAN

MGM111A256V1
Silicon
19+
1
31-smd 模块

MMRF1007HR5
NXP
21+
8000
LDMOS

MPVZ4006GW6U
NXP
21+
4800

MPVZ4006GW7U
NXP
21+
5600

MPVZ4006G6U
NXP
21+
8000

KCIMX6X1CVK08AB
NXP
21+
2000
LFBGA400

MIMX8MM2CVTKZAA
NXP
21+
8000
LFBGA486

SY5881FAC
SILERGY
21+
50000
SO8

SY5882NFAC
SILERGY
21+
50000
SO8

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Part No. MFG D/C QTY Packaging Package
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