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Part No.
MFG
D/C
QTY
Packaging

T70RIA16
Infineon
10+
230
可控硅 模块

A1215D-2W
MORNSUN金升阳
14+
8000
DIP

CY23S05SXC-1H
Cypress
16+
3000

BYI-1T
Microsemi
16+
669

72T36125L5BBGI
IDT
16+
6
PBGA-240

72V255LA15TFI8
IDT
16+
1500

EPC1213LI20
Altera
16+
250
PLCC-20

SSDSCKKF180H6X1
Intel
16+
12

DCP021212DP
TI
16+
361
隔离式DC|DC转换器

FRN1.5G1E-4C
FUJI
3
1.5KW 3HP 380V

HMC641ALP4E
Hittite
17+
214
24 ld QFN (4x4mm w/2.7mm ep),LFCSP:LEADFRM CHIP SCALE

ADR3433
AD
17+
6606
6 ld SOT-23

ZIPPER
Lime
19+
1

HMC929LP4ETR
AD
19+
500
24-vfqfn 裸露焊盘

SC1894A-00B13E
Maxim
19+
1000
64-vfqfn 裸露焊盘

ADMV7320BCEZ
AD
19+
1000
50-bflga exposed pad

LISA-U200-03S-02
U-Blox
19+
300
76-smd 模块

Y1545
Laird
19+
296

ACA-104-T
Abracon
19+
100

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