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Part No.
MFG
D/C
QTY
Packaging

2SD315AI-33
CONCEPT
02+
79
IGBT

MSG100L41
TOSHIBA
06+
220
MODULE

FS25R12KE3G
EUPEC
176
25A 1200V IGBT6U

MG75J2YS1
TOSHIBA
07+
95
IGBT

MCC700-18IO1W
IXYS
11+
2180
WC-500

FAN2501S25X
fairchild
11+
10000
SOT-23

MJE350
fairchild
11+
10000
TO-126

T1189N18TOF
EUPEC
10+
240
可控硅

5120523-2
TE
6000
1毫米Free Height (IEEE 1386)

SKM300MLI066TAT
SEMIRKON
14+
80
可控硅

RM10TA-H
MITSUBISHI
10+
80
可控硅

MS2554
Microsemi
16+
33

72225LB10TF
IDT
16+
1365
TQFP-64

S29GL064N90TFA043
Cypress
16+
1294

S99AL008J0313
Cypress
16+
917

SSDSC2BF360H501
Intel
16+
20
360GB

CY14B101KA-ZS45XI
Cypress
16+
226
TSOP II-44

CG8084AA
Cypress
16+
568

STP45NF06
ST
15+
5600
TO-220AB

HMC656-Die
Hittite
17+
747
CHIPS OR DIE

HMC6505A
Hittite
17+
152
32 ld LCC

SQM50P08-25L
VISHAY
17+
9000
TO-263

WT32I-E-AI61IAP
Silicon
19+
500

ETRAB7603P
Laird
19+
269

11-28FS-SN-16
Laird
20+
58723

SA602AD,623
NXP
21+
1900
SO8

100526-3
TE
1950
2毫米硬公制联系及配件

5-102619-4
TE
1950
100英寸 AMPMODU Headers

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Part No. MFG D/C QTY Packaging Package
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