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Part No.
MFG
D/C
QTY
Packaging

AD767SD/883B
ADI
10+
2500

TD142N16KOF
EUPEC
10+
79
MODULE

TD162N
EUPEC
10+
104
MODULE

TD170N16
EUPEC
10+
170
MODULE

TTB6C165N16RR
EUPEC
05+
106
MODULE

TZ425N12KOF
EUPEC
05+
83
MODULE

DZ540N
Infineon
10+
180
可控硅 模块

TD120N16
Infineon
10+
155
可控硅 模块

TD170N600
Infineon
10+
280
可控硅 模块

YA982C3R
FUJI
11+
8000
TO-220AB

T345N12TOF
EUPEC
10+
190
可控硅

T345N16TOF
EUPEC
10+
320
可控硅

HMC541LP3ETR-AN
AD
16+
109

HMC408LP3E
AD|Hittite
16+
126

HMC905LP3E
AD|Hittite
16+
41

MC13237CHTR
NXP|Freescale
16+
578

BGS12AL74E6327XTSA1
Infineon
16+
130

CC2560AYFVR
TI
16+
3055

DZ435N36K
Infineon
16+
42

TZ800N12KOF
Infineon
16+
42

TZ600N12KOF
Infineon
16+
66

723631L15PFG8
IDT
16+
78
TQFP-120

AD7814
AD
17+
2229
8 ld MSOP,8 ld SOIC,CHIPS OR DIE

AD588
AD
17+
210
8 ld SOIC,ROUND HEADER/METAL CAN

FDC2310
MACOM
20+
1500
Open Carrier

MGM111A256V1
Silicon
19+
1
31-smd 模块

MMRF1007HR5
NXP
21+
8000
LDMOS

MPVZ4006GW7U
NXP
21+
5600

MPVZ4006G6U
NXP
21+
8000

MPXV12GW6U
NXP
21+
4800

KCIMX6X1CVK08AB
NXP
21+
2000
LFBGA400

MCIMX7D2DVK12SD
NXP
21+
5000
TFBGA488

RF11021G42GA
JWD(经纬达)
2994
THT

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Part No. MFG D/C QTY Packaging Package
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