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Part No.
MFG
D/C
QTY
Packaging

2MBI200LB-060
FUJI
05+
180
MODULE

VBO20-12NO2
IXYS
11+
1580
FO-A

NCP500SQL30T1G
ON
11+
15000
DFN-6

MJH11022G
ON
11+
15000
SOT-93-3|TO-218-3

BAS21SLT1G
ON
11+
15000
SOT23-3

LP2988IMM-2.8|NOPB
NS
11+
2500
MINI SOIC

8-292260-6
TYCO
4000

MAX2471EUT+T
Maxim
16+
2238

S29GL512P10TFCR205
Cypress
16+
22407

LXDC2HL11F-315
Murata
16+
73

HFA105NH60R
IR
885
模块

HMC369LP3TR
AD
19+
1000
16-vfqfn 裸露焊盘

AMW037
Silicon
19+
207
模块

AEACBK050048-MW2
Abracon
19+
100

2144280001
Molex
19+
5000

11-28RH-BD-16
Laird
20+
32620

24S-CBSA-0.5X5.75X0.2
Leader
20+
1184

LS1021ASN7KQB
NXP
21+
1900
FBGA525

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