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Part No.
MFG
D/C
QTY
Packaging

7MBP50RA-060
FUJI
05+
114
MODULE

1-178318-2
TYCO
6000

SK100WT12
SEMIRKON
14+
10
可控硅

APT2X30DC60J
Microsemi
15+
800
SOT227

MEV1D0515SC
Murata
16+
56
DIP

AC2626
AD
17+
725
2 ld Flat Pack,3 ld TO-52,8 ld SOIC,CHIPS OR DIE,LFCSP:LEADFRM CHIP SCALE

FR05-S1-NO-1-003
Fractus
19+
2500

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