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Part No.
MFG
D/C
QTY
Packaging

BSM50GB60
EUPEC
05+
64
IGBT

170M7061
BUSSMANN
52

170M7084
BUSSMANN
64

170M7099
BUSSMANN
45

170M7124
BUSSMANN
52

IXSH30N60C
IXYS
11+
980
TO-247

MJE5852
ON
11+
15000
TO-220-3

MMSD103
ON
11+
15000
SOD-123-2

5120534-2
TE
3000
1毫米Free Height (IEEE 1386)

2202503-2
TE
6000
迷你串行连接SCSI(小型SAS HD)高密度电缆组件

2202504-1
TE
3000
迷你串行连接SCSI(小型SAS HD)高密度电缆组件

1-2127833-5
TE
5000
迷你串行连接SCSI(小型SAS)电缆组件

68301835-03
TE
5000
电缆安装插座

5226279-2
TE
5000
UHF/微型UHF,RF连接器

206210-2
TE
4000
ARINC 600/404 Contacts and Accessories

M5060THC1000
Crydom
15+
20
二极管

SY89420VJZ-TR
Microchip|Micrel
16+
449
PLCC-28

IS61WV5128EDBLL-10KLI-TR
ISSI
16+
210
SOJ-36

FPLR12TR7510NA
Fujitsu
16+
312

TPS82673SIPR
TI
16+
396
SMD|SMT

170M6814
BUSSMANN
40
熔断器

520437-1
TE
6000
SDL(屏蔽数据链接)

1-1761187-6
TE
6000
SDL(屏蔽数据链接)

D3C0810N-5
DiTom
2020+
3949
环形器

TRM-868-DP1203
Linx
19+
132
21-smd 模块

ANT-DB1-RAF-SMA
Linx
19+
236

ANT-DB1-HDP-RPS
Linx
19+
4500

WIH-AT-FA-36
Thomas
19+
2000

G-0500TB0675-0080XC
Orbel
20+
25

MC33797BPEWR2
NXP
21+
2000

MC33SA0528ACR2
NXP
21+
4800

MMA6910KQ
NXP
21+
8000
HQFN16

MK70FN1M0VMJ12R
NXP
21+
8000
LBGA256

LS2088AXN7V1A
NXP
21+
3560
BGA1292

SY50211WAZC
SILERGY
21+
210000
SOT33-5

FPR2514-200M
JWD(经纬达)
2295

MC0503A-3R3M0
JWD(经纬达)
3000

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