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Part No.
MFG
D/C
QTY
Packaging

2MBI150F-060X3
FUJI
10+
322
module

1-499345-0
TYCO
4000

LH20-10A05
MORNSUN金升阳
14+
4000
卧式封装

1-5146896-2
TE
1950
1毫米Free Height (IEEE 1386)

S34ML02G100TFB000
Cypress
16+
1966
BGA-63

55-CBSF-7.0X8.25
Leader
20+
5238

MRFE6VP61K25GSR5
NXP
21+
1500
LDMOS

AFT21S240-12SR3
NXP
21+
9000
LDMOS

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