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Part No.
MFG
D/C
QTY
Packaging

PH75S110-5
LAMBDA
05+
220
MODULE

W0614WC200
WESTCODE
69
614A 2000V

FZ1200R12KF5
EUPEC
08+
110
IGBT

MC74AC20DR2G
ON
11+
15000
SOIC-14

74FST3257
ON
11+
15000
QFN-16

SMBJ45A
fairchild
11+
10000
DO-214AA(SMB)

T820067504DH
powerex
11+
300
模块

R7011403XXUA
powerex
11+
300
模块

644482-9
TYCO
4000

T589N14TOF
EUPEC
10+
180
可控硅

6-1734024-1
TE
6000
堆叠连接器

MSB1215D-3W
MORNSUN金升阳
14+
800
DIP

APTM20AM10STG
Microsemi
15+
230
SP4

BQ2204ASN-N
TI
16+
70
SOIC-16

EC4AW02
Cincon
16+
2
DIP-24

AD8333
AD
17+
269
32 ld LFCSP (5x5mm) w/3.1mm exposed pad

AD9522-5
AD
17+
293
CMOS, LVDS

MADA2030G
MACOM
20+
2000
DIE

D4I1722N-3
DiTom
2020+
1736
隔离器

XB8-DMPS-062
Digi
19+
1
模块

R2T58-24-RTNC
Laird
19+
10

21-CBSA-3.5X4.0X0.225
Leader
20+
2013

23-CBSA-3.25X4.25X0.25
Leader
20+
1184

58-CBSA-2.75X4.0X0.5
Leader
20+
832

24S-CBSA-1.75X4.5X0.2
Leader
20+
1680

49L-CBSA-0.5X5.75X0.4
Leader
20+
2300

84NH-CBSA-1.5X5.75X0.8
Leader
20+
2013

21-CBSA-3.25X6.0X0.225
Leader
20+
225

14-CBSA-4.0X5.75X0.13
Leader
20+
593

PCA9674APW,112
NXP
21+
5600
TSSOP16

LPC1778FBD144K
NXP
21+
5600
LQFP144

5-104655-7
TE
5000
.050英寸AMPMODU 50/50 Grid

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Part No. MFG D/C QTY Packaging Package
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