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Part No.
MFG
D/C
QTY
Packaging

2SD315AI-33
CONCEPT
02+
79
IGBT

FS15R06XL4
EUPEC
98
15A 600V IGBT6U

MG75J2YS1
TOSHIBA
07+
95
IGBT

W0508SA120
IXYS
11+
1580
SW12PHN300

MCC700-18IO1W
IXYS
11+
2180
WC-500

TT105N12LOF
EUPEC
10+
181
module

FAN21SV06EMPX
fairchild
11+
10000
MLP 25-LEAD

FAN2501S25X
fairchild
11+
10000
SOT-23

KST4403
fairchild
11+
10000
SOT23 3-LEAD

FS10VS-5
powerex
11+
100
模块

T1189N18TOF
EUPEC
10+
240
可控硅

5120523-2
TE
6000
1毫米Free Height (IEEE 1386)

RM10TA-H
MITSUBISHI
10+
80
可控硅

MS2554
Microsemi
16+
33

MCC26-14io8B
IXYS
16+
10

72225LB10TF
IDT
16+
1365
TQFP-64

S99AL008J0313
Cypress
16+
917

CY14B101KA-ZS45XI
Cypress
16+
226
TSOP II-44

CG8084AA
Cypress
16+
568

HMC656-Die
Hittite
17+
747
CHIPS OR DIE

HMC6505A
Hittite
17+
152
32 ld LCC

STD90NS3LLH7
ST
17+
5000
DPAK

IRLZ34 SiHLZ34
VISHAY
17+
8000
TO-220AB

SQM50P08-25L
VISHAY
17+
9000
TO-263

GM16397
Laird
19+
1

WT32I-E-AI61IAP
Silicon
19+
500

FXUWB20.07.0100C
Taoglas
19+
145

11-28FS-SN-16
Laird
20+
58723

SA602AD,623
NXP
21+
1900
SO8

MKL02Z32VFG4
NXP
21+
5600
HUQFN16

100526-3
TE
1950
2毫米硬公制联系及配件

5-102619-4
TE
1950
100英寸 AMPMODU Headers

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