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Part No.
MFG
Packaging
D/C
QTY
Note
PDF
inquiry
HSOP..
>21+
1900
HSOP..
>21+
1500
HSOP..
>21+
5000
HSOP..
>21+
8000
HSOP..
>21+
5000
HSOP..
>21+
8000
低噪..
>20+
1600
24 l..
>17+
4898
24 l..
>17+
2229
>16+
47
隔离..
>16+
65
>16+
50
TO22..
>11+
10000
TO22..
>11+
10000
TO-2..
>11+
15000
D2PA..
>11+
15000
D2PA..
>11+
15000
TO-2..
>11+
15000
D2PA..
>11+
15000
D2PA..
>11+
15000
TO-2..
>11+
15000
D2PA..
>11+
15000
SOIC..
>11+
15000
SOIC..
>11+
15000
SOIC..
>11+
15000
TSSO..
>11+
15000
SOIC..
>11+
15000
TO-2..
>11+
15000
D2PA..
>11+
15000
TO-2..
>11+
15000
D2PA..
>11+
15000
D2PA..
>11+
15000
D2PA..
>11+
15000
TO-2..
>11+
15000
D2PA..
>11+
15000
IGBT
>09+
79
MODU..
>08+
79
>10+
2500

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